Categories | LED Light Components |
---|---|
Brand Name: | Double LIGHT |
Model Number: | DL-PW10SRC |
Certification: | ISO9001:2008,Rosh |
Place of Origin: | China |
MOQ: | 1000 PCS |
Payment Terms: | Telegraphic Transfer in Advance (Advance TT, T/T) |
Supply Ability: | 15,000,000pcs per Day |
Delivery Time: | 5-7 working days after received your payment |
Packaging Details: | Dimensions per Unit:0.28 × 0.2 × 0.13 Meters • Weight per Unit:3.5 Kilograms • Units per Export Carton:40000 • Export Carton Dimensions L/W/H: 0.45 × 0.28 × 0.27 Meters • Export Carton Weight:14.2 Kilograms |
Product Name: | 1W High Power Red Color LED |
Emitted Color: | Red Color LED |
Test Condition: | IF=350ma |
Viewing Angle: | 120 Deg |
Luminous Flux: | 45lm |
Forward Voltage: | 1.8-2.2v |
Chip Material: | AllnGaP |
Peak Emission Wavelength: | 625nm |
1W High Power Red Color LED Light Components 35 - 45lm 620 - 630nm 640-660nm for Plant grow lighting
1W High Power Red Color LED
Precautions for Use:
1. Over-current-proof
Customer must not use the device in reverse and should apply
resistors for extra protection. Otherwise slight voltage shift may
cause abnormal current change and burn out failure would happen.
2. Storage
①Do not open moisture proof bag before the products are ready to be
used.
②Before opening the package, the LEDs should be kept at 30℃ or less
and 90%RH or less.
③The LEDs should be used within a year.
④After opening the package, the LEDs should be kept at 30℃ or less
and 70%RH or less.
⑤The LEDs should be used within 168 hours (7 days) after opening
the package.
⑥If the moisture absorbent material (silicone gel) has faded away
or the LEDs have exceeded the storage time, baking treatment should
be performed using the following conditions:
Pre-curing treatment: 60±5℃ for 24 hours.
3. Thermal Management
①Because HP60M LED is a high power dissipation device, special and sufficient consideration in thermal management design must be made to optimize the thermal performance.
②Heat sink design is implemented in the device for an additional thermal connection. Since the device is capable of SMT process, tin must be spread both heat sink and solder pads areas to dissipate the heat.
③A high thermal conductivity substrate, such as Aluminum or Copper plate etc, must be applied for external thermal management. It is strongly recommended that the outer heat sink or PCB dimension per LED can not be less than 25 x 25 x 1 (L x W x H) mm. The materials for outer heat sink can be FR4 on Aluminum, MCPCB, or FPC on Aluminum.
④Special thermal designs are also recommended to take in outer heat sink design, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc.
⑤Sufficient thermal management must be conducted, or the die
junction temperature will be over the limit under large electronic
driving and LED lifetime will decrease critically.
4. Soldering Condition
①Soldering should not be done more than two times.
②While soldering, do not put stress on the LEDs during heating.
③After soldering, do not warp the circuit board.
5. Soldering Iron
①For prototype builds or small series production runs it is possible to place and solder the LED by hand.
②Dispensing thermal conductive glue or grease on the substrates and follow its curing spec. Press LED housing to closely connect LED and substrate.
③It is recommended to hand solder the leads with a solder tip temperature of 280°C for less than 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal.
④Be careful because the damage of the product is often started at
the time of the hand solder.
6. Handling Indications
During processing, mechanical stress on the surface should be
minimized as much as possible. Sharp objects of all types should
not be used to pierce the sealing compound.
Absolute Maximum Ratings at Ta=25℃
Parameters | Symbol | Rating | Units |
Forward Current | IF | 350 | mA |
PeakPulseCurrent (tp≤100μs, Duty cycle=0.25) | I pulse | 500 | mA |
Reverse Voltage | VR | 5 | V |
LED Junction Temperature | Tj | 125 | ℃ |
Operating Temperature Range | Topr | -40 to +80 | ℃ |
Storage Temperature Range | Tstg | -40 to +100 | ℃ |
Soldering Time at 260 ℃ (Max.) | Tsol | 5 | Seconds |
Notes:
1. Proper current derating must be observed to maintain junction
temperature below the maximum.
2. LEDs are not designed to be driven in reserve bias.
Electrical Optical Characteristics at Ta=25℃
Parameters | Symbol | Min. | Typ. | Max. | Unit | Test Condition |
Viewing Angle [1] | 2θ1/2 | --- | 140 | -- | Deg | IF=350mA |
Forward Voltage [2] | VF | 2.0 | 2.20 | 3.00 | V | IF=350mA |
Reverse Current | IR | --- | --- | 10 | µA | VR=5V |
Peak Emission Wavelength | λp | --- | 632 | --- | nm | IF=350mA |
Dominant Wavelength | λd | --- | 624 | --- | nm | IF =350mA |
Spectrum Radiation Bandwidth | Δλ | --- | 18 | --- | nm | IF=350mA |
Luminous Flux | Фv | 25 | 30 | --- | lm | IF=350mA |
Notes:
1. 2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 2. Forward Voltage measurement tolerance: ±0.1V
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