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Single Point Small Wave Hot Bar Soldering Machine Laser Soldering System

Categories Hot Bar Soldering Machine
Brand Name: ChuangWei
Model Number: CWLS-S
Certification: CE ISO9001
Place of Origin: China
MOQ: 1Set
Price: Negotiable
Supply Ability: 100sets
Delivery Time: 10days
Packaging Details: plywood case
Melting Time: 20-30 Minutes
Tin Groove Power: 1.2KW
Small Wave Soldering Nozzle: Custom Shape
Tin Tank Capacity: 15kgs/furnace
Total power: 5KW
Power: Single Phase 220V 50HZ
Size: L850*W1100*H1340mm
Weight: 200KG
Name: Single Point Small Wave Soldering Nozzle White Selective Soldering Machine
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    Single Point Small Wave Hot Bar Soldering Machine Laser Soldering System

    Single Point Small Wave Soldering Nozzle White Selective Soldering Machine


    Application: welding PCB components


    Spot- and Seam WeldingLaser Deposit Welding

    From smallest welding spots to continuous seams

    Repair and modification with reconditioned quality

    Scanner WeldingTube and Profile Welding

    No time loss by movement of workpieces or processing heads

    Optimal laser welding of tubes and profiles


    Product Parameters


    Entry NameTechnical Parameters
    Machine modelCWLS-S
    Total power5KW
    PowerSingle Phase 220V 50HZ
    Tin Tank Capacity15kgs/furnace
    Melting Time20-30 Minutes
    Tin Groove Power1.2KW
    Small Wave Soldering NozzleCustom Shape
    SizeL850*W1100*H1340mm
    Weight200KG

    Where conventional soldering techniques reach their limits

    Laser soldering is often applied as selective laser soldering. Selective soldering processes are used in applications where other conventional selective soldering techniques reach their limits. These limits can be for example defined by temperature-sensitive components. The transfer of heat and energy through the laser beam provides the user with many advantages, especially with view to the miniaturization of sub-assemblies or sensitive components.

    During the soldering process, the filler metal or alloy is heated to melting temperatures < 450°C by laser. Therefore lasers with lower output powers (typically < 100 Watts) are used to melt the wire material, soldering paste or solder deposits so that it flows in between the two closely fitted joining materials.

    For soldering small parts or components within the semiconductor, electronic or opto-electronic device manufacturing or assemblies industry, the diode laser is the right choice. Diode lasers are used for selective soldering because the laser power can be precisely controlled by an analog signal and the heat input into the material is very localized. That is why laser soldering is most advantageous, compared to traditional soldering methods. The process does not damage or input heat into nearby components. That is why even very small electronic components, in the range of a few tenths of a millimeter, as well as heat sensitive electronic parts can be processed.

    Fast power controllability combined with a non-contact temperature measurement to minimize thermal damage make the diode laser an ideal tool for this application.

    Conventional selective soldering techniques, such as e.g. the soldering iron, need a direct mechanical contact between the soldering tool and the solder joint, or the soldering tool has to be very close to the solder joint. Yet, in many cases, this is not possible due to a lack of space. Furthermore, within conventional selective soldering processes, the energy input is either not or is very slowly able to be influenced during the soldering process.


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