Sign In | Join Free | My xpshou.com
China seisanzai-japan company logo
seisanzai-japan company
ICP Remarked Supplier
Home >

EDM to slice next-generation semiconductor materials

EDM to slice next-generation semiconductor materials

Country/Region china

Company seisanzai-japan company

Categories Aluminum Electrolytic Capacitors

Update 2020-05-22 02:14:54

ICP License Issued by the Chinese Ministry

Contact Now

DS1000 slices cylindrical configuration semiconducting materials into thin disk-shaped wafer.The DS1000 can machine simultaneously with multiple wires, producing up to 20 sheets at a time. This machine is compatible with next generation semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN).

China EDM to slice next-generation semiconductor materials

EDM to slice next-generation semiconductor materials Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: seisanzai-japan company
*Subject:
*Message:
Characters Remaining: (0/3000)
 

Home| Products| Suppliers| Quality Suppliers| Site Map |About Us |Contact Us |Help |关于我们 |联系我们

Copyright © 2009 - 2020 xpshou.com. All rights reserved.