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Fiber Optic Module Transceiver, XFP module compatible with Cisco, HP, Juniper, H3C..

Categories XFP Module
Place of Origin: China
Brand Name: DONGWE
Certification: CE, FCC, RoHS
Model Number: DW-D9685-03CX
MOQ: 1 piece
Price: please contact for latest price
Packaging Details: Standard package, carton
Delivery Time: 3-7 working days
Payment Terms: T/T
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Fiber Optic Module Transceiver, XFP module compatible with Cisco, HP, Juniper, H3C..

Fiber Optic Module Transceiver, XFP module compatible with Cisco, HP, Juniper, H3C..

The data rate of this series is 10G.DW-D96XX-XXCX are all dual fiber modules.They have duplex LC connectors.Distance of transmitter can be from 300m to 80km. All modules of Dongwe can be compatible with Cisco equipment.

Features

 Supports 9.95Gbps to 11.3Gbps bit rates
 Maximum link length of 300m (50um,MMF,2000MHz.Km)
 850nm VCSEL laser and PIN receiver
 XFP MSA Rev 4.5 Compliant
 No reference clock required
 +1.8V,+3.3V Supply Voltage
 Low Power Dissipation 1.5W Maximum
 XFI and lineside loopback Mode Supported
 0ºC to 70ºC Operating Case Temperature
 Diagnostic Performance Monitoring of module temperature, Supply Voltages, laser bias current, transmit optical power, and receive optical power
 RoHS6 compliant (lead free)
Applications
 10GBASE-SR/SW 10G Ethernet
 1200-Mx-SN-I 10G Fiber Channel
 Other optical links
 10GBASE-SR/SW 10G Ethernet with FEC
Description
DONGWE DW-D9685-03CX is compliant with the 10G Small Form-Factor Pluggable (XFP) Multi-Source Agreement (MSA), supporting data-rate of 10.3125Gbps(10GBASE-SR) or 9.953Gbps (10GBASE-SW), and transmission distance up to 300m on 50μm MMF (2000MHz.km).
The transceiver module comprises a transmitter with 850nm a vertical cavity surface emitting (VCSEL) laser and a receiver with a PIN photodiode. Transmitter and receiver are separate within a wide temperature range of 0℃ to +70℃ and offers optimum heat dissipation and excellent electromagnetic shielding thus enabling high port densities for 10 GbE systems.
The mechanical components defined:
1. The module, clip and connector dimensions are constant for all applications. While the bezel, cage assembly, EMI gasket and heat sink can be designed and/or adjusted for the individual application.
2. The relatively small form factor of the XFP module combined with an adaptable heatsink option allows host system design optimization of module location, heatsink shape/dimension/fins design, and airflow control. The module can be inserted and removed from the cage with the heat sink and clip attached.

References
1. 10 Gigabit Small Form Factor Pluggable Module (XFP) Multi-Source Agreement (MSA), Rev 4.5 – August 2005. Documentation is currently available at http://www.xfpmsa.org/
2. IEEE802.3ae – 2002
3. ITU-T G.709 / ITU-T G.959.1 http://www.itu.int/
4. Telcordia GR-253-CORE
Important Notice
Performance figures, data and any illustrative material provided in this data sheet are typical and must be specifically confirmed in writing by DONGWE before they become applicable to any particular order or contract. In accordance with the DONGWE policy of continuous improvement specifications may change without notice.
The publication of information in this data sheet does not imply freedom from patent or other protective rights of DONGWE or others. Further details are available from any DONGWE sales representative.
contact:
email: sales055@dongwe.cn
Skype: dongwe055
Mobile / whatsapp: +86 189 2640 2115
Web: http://www.dongwe.cn
http://www.fiber-optics-e.com
Product Tags:

module

  

XFP

  

10G

  
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