Traditional Black 2 Inch Waffle Pack Chip Trays For Electronic Parts

Traditional Black 2 Inch Waffle Pack Chip Trays For Electronic Parts

Precision-molded cavities designed to match your chip’s footprint—no rattling, shifting, or handling issues.

Waffle Pack is a form of packaging designed for use with parts that are either very small or unusual in shape. Waffle packs are embossed or pocketed trays, typically made of plastic, that resemble a breakfast waffle (hence the name). The waffle packs are loaded using pick and place equipment so that the "inside" of each pocket contains a part or component.

Anti-static tray can effectively release the static charge accumulated on the surface of the object, will not produce charge accumulation and high potential difference; It can greatly reduce the damage rate of electronic products in the production process, reduce the cost, and improve the product quality and profit.

Application:

Semiconductor Wafer Die Wafer Bare, Electronic components, optical electronic components, etc.

Technical Parameters:

FAQ:

Q1: Are You a Manufacturer or a Trade Company?

We are a 100% Manufacturer specializing in packaging for over 12 years with a 1500 square meter workshop area, located in Shenzhen, China.

Q2: What is the material of your product?

ABS, PC, PPE, MPPO, PEI, HIPS...etc.

Q3: Can you help with the design?

Yes, we can accept your customization and do the packaging for you according to your requirements.

Q4: How can I get the quotation for the custom products?

Let us know the size of your IC or component thickness, and then we can make a quotation for you.

Q5: Can I get some samples before making a bulk order?

Yes, the free sample in stock can be sent, but the shipping fee should be paid by you.

Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please.

Q7: When can we get the samples?
We can send them right now if you are interested in something we have in stock, and customize the project depending on the specific time.

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions. Hiner-pack has mastered special processing techniques and manufacturing in the semiconductor packaging raw material field. Owned a lot of inventions and practical new patents. Through years of unremitting efforts, Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to be launched, and to solve the customer demand for high-quality products.

Learn more through our official website: https://www.hiner-pack.com/english/