Specific Gravity 3.3 G/Cm^3 Moldability For Complex Parts Memory Modules Silicone Pads
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Specific Gravity 3.3 g/cm^3 Moldability for Complex Parts Memory Modules Silicone Pads The TIF760M thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high ......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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Silicone 20 Shore 00 Cpu Thermal Pad For Rdram Memory Modules
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Outstanding thermal performance silicone pads for RDRAM memory modules ,20 Shore 00 Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing ......
Dongguan Ziitek Electronical Material and Technology Ltd.
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TIF500-18-11U Insulation Gray Silicon Thermal Pad For RDRAM Memory Modules
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TIF500-18-11U Insulation Gray Silicon Thermal Pad For RDRAM Memory Modules Product descriptions TlF®500-18-11U Series is an ultra-soft thermal interface material designed specifically to protect ......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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HW-523B A160 16 Way 5V Relay Module Control Board Optocoupler Protection Memory Module Cards
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HW-523B Module Photosensitive resistance relay control module HW-523B #detail_decorate_root .magic-0{border-bottom-style:solid;border-bottom-color:#53647a;font-family:Roboto;font-size:24px;color:#53647a;font-style:normal;border-bottom-width:2px;padding......
Shenzhen Kaigeng Technology Co., Ltd.
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Original Memory Module M425R1GB4BB0-CWM 1x 8GB DDR4-5600 SODIMM (1G x 16) x 4 Server Memory Module
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Beijing Hui Tong High Tech Limited.
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Hot selling SKKT106/16E 106A1600V Thyristor Module Silicon Controlled Rectifier SCR Temperature Control
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ShenZhen QingFengYuan Technology Co.,Ltd.
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Memory Module Slot Dell R7625 2U Server Chassis with Private Mold and AMD EPYC CPU
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Junling Sihai Technology Group Co., Ltd.
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ABB MEM86-E128K Backup Memory Module for Industrial Control Systems High-Performance
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Wisdomlong Technology CO.，LTD
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Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules
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Attribute Value Test Method Composition Ceramic filler + Silicone - Color Green Visual Density(g/cc) 2.9 ASTM D792 Extrudability(g/s) 5.0 ISO9048 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥5.0 ASTM D149 Dielectric Constant(@10mhz......
Shenzhen Aochuan Technology Co., Ltd
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BERGQUIST GAP PAD TGP HC5000S Heat Conduction Insulation Silicone Thermal Pad
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...PAD TGP HC5000S heat conduction insulation silicone pad Product features/Applications: Thermal Conductivity: 5.0 W/m-K High-compliance, low compression stress；Fiberglass reinforced for shear and tear resistance. Used in telecommunications, Integrated circuits ,digital signal processing systems, consumer electronics, hot modules......
SZ PUFENG PACKING MATERIAL LIMITED
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